IPC-7525 Solder-Paste Stencil Area-Ratio, Homeplate & QFN-Window Compiler (.DXF)

Deterministic IPC-7525A aperture area ratio AR = L*W / (2*(L+W)*t) >= 0.66 + homeplate mid-chip solder-ball suppression geometry engine (.dxf, .gbr, .svg) built for LPKF, DEK ASM, JLCPCB, OSH Stencils — zero-upload ephemeral Wasm RAM execution.

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Cloudflare Ephemeral Wasm RAM · 0% Retention

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